Facebook   Follow ApexElecLtd on Twitter
Find part

   Login   Register


Internet banking

Alpha and Omega Semiconductor - New Ground Exposed Die Pad Power IC Platform - 8 November 2012

An innovative packaging technology capable of exceptional power dissipation.

  Product page

  • The high performance of this EZBuck™ dc/dc platform is attributed to a combination of IC design, low on-resistance MOSFET technology and proprietary exposed ground pad packaging technology. The new platform enables more thermally efficient dc/dc solutions for consumer, networking and industrial applications.
  • The ground exposed die pad platform combines a current-mode step-down controller IC with integrated high-side and lowside MOSFETs. The vertical MOSFET structure features outstanding on-res. performance allowing more power delivery in a smaller area, while the pad transfers heat directly to the printed circuit board's ground plane acting as a large heat sink. Another benefit is that it reduces electromagnetic interference and noise coupling into the system.
  • The high-side p-channel MOSFET and low-side n-channel MOSFET with integrated Schottky diode, combined with a bond-wireless packaging technology deliver best-in-class junction temperature performance for a 30W, 12V to 5V post-regulating application.
  • The first EZBuck™ products with the new featured platform will be available within the first quarter of 2013

 Print results    Save results

Copyright © 2012 Apex Electronics Ltd New Zealand All Rights Reserved.