The high performance of this EZBuck™ dc/dc platform is attributed to a combination of IC design, low on-resistance MOSFET technology and proprietary exposed ground pad packaging technology. The new platform enables more thermally efficient dc/dc solutions for consumer, networking and industrial applications.
The ground exposed die pad platform combines a current-mode step-down controller IC with integrated high-side and lowside MOSFETs. The vertical MOSFET structure features outstanding on-res. performance allowing more power delivery in a smaller area, while the pad transfers heat directly to the printed circuit board's ground plane acting as a large heat sink. Another benefit is that it reduces electromagnetic interference and noise coupling into the system.
The high-side p-channel MOSFET and low-side n-channel MOSFET with integrated Schottky diode, combined with a bond-wireless packaging technology deliver best-in-class junction temperature performance for a 30W, 12V to 5V post-regulating application.
The first EZBuck™ products with the new featured platform will be available within the first quarter of 2013
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