NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise.
These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications.
A global semiconductor company with operations in more than 25 countries.
As computing systems become faster, signal integrity tends to deteriorate more rapidly than in slower systems.
NXP's USB 3.0 redriver solution provides signal equalization on a weakened signal, followed by transmit de-emphasis, thus maximizing link performance, enhancing signal integrity and improving system reliability.
Progress in Liquid Crystal Display (LCD) medical imaging technology has led to its increasing adoption for diagnostic viewing of medical images.
Although LCD monitors have many advantages, cost continues to be a factor when medical professionals choose equipment.
Mounting the display glass and driving circuit directly onto a printed circuit board (PCB) results in a complex and area-intense PCB design.
NXP has developed a Chip-on-Glass LCD driver approach whereby the integrated circuit mounts directly on the display glass, with the overall impact being a reduction in system cost. COG is a very reliable and well-established technology, which is often used in the automobile industry.
NXP's SSL4120 Greenchip solution, combining a PFC and an HBC, delivers high efficiency (>93%), low THD (<10%), and high PF (>0.97) in high-power LED applications from 75 to 400 W.
NXP's new family of 8-bit and 16-bit GPIO devices featuring "Agile I/O" - an innovative option integrating the most commonly needed functions in embedded systems.
Flexibility, Choice and Availability
The extensive selection of device options and packages allows system designers to select the right device for their designs at the optimum price point. The new GPIO expanders will be offered in TSSOP, as well as 0.5-mm pitch QFN package options, with the first product types available immediately.
The PCA(L)6408AHK is also released in a smaller 0.4-mm pitch QFN and the PCA(L)6416AEV in 0.5-mm pitch BGA. The Agile I/O version of both of these devices will also be released in a 0.4-mm pitch BGA package for the growing thin portable market.
State-of-the-art DC6M DC-DC switching regulator family featuring a very high 6-MHz frequency, an ultra-low output voltage ripple performance of 7 mV and high efficiency up to 95%.
The NCF2960 addresses the strong demand from car OEMs for fashionable and distinctive car key designs. The chip's package size has been reduced by 44% compared to the previous generation.
Featuring advanced signal processing capabilities and a wide range of connectivity options.
Operating at speeds of up to 120 MHz, the LPC408x and LPC407x provide up to 512 KB of flash, 96 KB of SRAM, 4 KB of EEPROM, two analog comparators, and a wide range of connectivity peripherals, including up to five UARTs, three SPI/SSP, and three I2C interfaces.
The LPC408x and LPC407x series feature a multi-layer AHB bus that allows high-bandwidth peripherals such as Ethernet and full-speed USB to run simultaneously, without affecting performance.
Other serial peripherals include two CAN controllers, SD/MMC and an I2S interface.
IP4294 is designed to protect high-speed interfaces such as SuperSpeed USB, High-Definition Multimedia Interface (HDMI), DisplayPort, external Serial Advanced Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces against ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for ultra high-speed signal lines and is encapsulated in an ultra small and leadless XSON10 plastic package.
NXP announced the expansion of its transistor portfolio in the ultra-small discrete flat no-leads package DFN1006B-3 (SOT883B).
NXP now offers 60 bipolar transistors (BJT) and 12 small-signal single N- and P-channel Trench MOSFETs in the 1-mm x 0.6-mm x 0.37-mm DFN plastic SMD package - the industry's largest portfolio in the smallest transistor package (DFN1006) available today.
Easy-to-use, low-power USB solutions based on ARM Cortex-M0 with more memory and package configuration options.
The LPC11U30 supports the latest USB 2.0 specification with Link Power Management (LPM) mode, which allows a device to enter a suspended state when not in use.
It also offers on-chip power profiles optimized for specific power levels, including a Low Current mode ideal for battery-powered applications that only connect to USB for occasional charging or data download.
NXP Semiconductors introduces the PMPB11EN and PMPB20EN 30V N-Channel MOSFETs, the first of more than 20 devices housed in the DFN2020MD-6 (SOT1220) a 2-mm x 2-mm low-profile DFN package with tin-plated, solderable side pads.
With the industry's lowest active power consumption at 110 uA/MHz and reduced deep sleep current below 2µA, the LPC1100XL has set a new benchmark for low-power ARM® Cortex™-M0 microcontrollers.
The dramatic reductions in power consumption in the LPC1100XL are complemented by on-chip "power profiles" - a unique industry implementation of real-time power management.
Optimized for CPU performance, efficiency and lowest active current, the power profiles enable maximum operating frequency through the entire voltage range from 1.8V to 3.6V without compromising speed or functionality, making the LPC1100XL an ideal choice for all low-power 8/16-bit applications.
The LPC1100XL incorporates NXP's proprietary embedded flash which extends solutions to 64 KB while incorporating 256 bytes of page erase. The 256-byte page-erase feature significantly improves the efficiency and ease of use of the on-chip flash, allowing for seamless field updates without having to erase a large sector to write the next page.
